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European Conference on Integrated Optics 2017

03 april - 05 april | Eindhoven University of Technology, Blauwe Zaal | Website

The European Conference on Integrated Optics has now reached its 19th edition. Innovation and industry uptake is accelerating, and to capture this increasing pace, we are now transitioning to an annual event.

In 2017 we return to Eindhoven at the Science Park of the Technical University of Eindhoven. We will retain the same clear focus on leading edge research, providing a forum for experts from industry and academia to share the latest new thinking and exchange new insights and findings in the fields of integrated optics, optoelectronics and nanophotonics.

The conference scope extends from new enabling materials to the design and modelling of photonic structures, functions, devices and circuits. We also capture innovations in hybrid integration, system-on-chip and system-in-package integration. Application areas range from optical tele- and data communications; optical interconnects, switching and storage; data and information processing, including integrated quantum circuits; and optical monitoring and sensing, including mid-IR photonics. Conference topics include for example:

Waveguide technology and platforms
  • Silicon photonics
  • III-V optoelectronics
  • Compound semiconductors
  • Membrane photonics, wafer and die bonding technologies
  • Dielectric and polymer photonics
  • Non-linear and electro-optic materials
  • Mid and far infrared, THz
  • Production methods and foundry concepts
Devices and materials
  • Waveguide devices – fibres, waveguides, multiplexers, diffractive optical elements
  • Functional devices – switches, buffers, programmable filters, isolators, polarizers
  • Nonlinear devices – wavelength converters, mixers and regenerators
  • Plasmonic waveguides and devices
  • Nanophotonics, photonic crystals, subwavelength and metamaterials
  • Active devices – lasers and laser arrays to amplifiers, modulators and detectors
  • New Materials for Photonics: graphene and 2D materials, phase change materials
Integrated Circuits
  • Assembly, packaging and hybrid integration techniques
  • Test and characterisation of photonic integrated circuits
  • Optical connectivity – fiber-attachment, waveguides, micro-benches and free-space
  • Electronic connectivity
  • Flip chip bonding
  • Quantum and high precision photonics
  • Optomechanical devices and micro and nano electro mechanical systems
Application of PICs
  • Tele/datacom communication, optical interconnects
  • Biological, chemical and other sensing transducers
  • Spectroscopy
  • Quantum computing
  • Free-space optical communications
  • Photonic A/D conversion, logic, memoriess
  • Data storage, imaging, display and beyond

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